Surface processing device and surface processing method
AssigneeToyota Jidosha Kabushiki Kaisha
InventorsTakehito Kobayashi, Noriyuki Ueno, Katsuya Kurachi
Life of this patent
Estimating the term…
Abstract
In the present invention, the form in which roughness is formed on the surface of an article being processed through plasma exposure is controlled by varying the frequency for a main voltage applied to two discharge electrodes, a conductive housing and a rod shaped electrode, provided in a plasma generating unit and the frequency for a bias voltage applied between the conductive housing (2) and the article being processed.
Claims23
A surface processing device for processing a surface of a workpiece by plasma irradiation, comprising:
- a plasma generating unit for generating plasma in response to application of a voltage between two electrodes;
- a first AC power source for supplying a main voltage to be applied between the two electrodes of the plasma generating unit;
- and
- a second AC power source for supplying a bias voltage to be applied between one of the electrodes of the plasma generating unit and the workpiece, the bias voltage having the frequency different from the frequency of the main voltage,
- wherein relative positions of the plasma generating unit and the workpiece are changed at a certain speed while radiating plasma from the plasma generating unit.
A surface processing method for processing a surface of a workpiece by irradiating a surface of a workpiece with plasma generated in response to application of a main voltage between two electrodes, the method being comprising:
- applying a bias voltage between one of the two electrodes and the workpiece, and setting the frequency of the main voltage supplied as an AC voltage to be different from the frequency of the bias voltage also supplied as the AC voltage;
- and
- moving a plasma irradiation position on the surface of the workpiece at a certain speed while radiating plasma.
23-34. (canceled)
Dependencies are inferred from the claim text.