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US 2014/0110266 A1Published application
Thin-tin tinplate
AssigneeRohm and Haas Electronic Materials LLC
InventorPeter R. LEVEY
Life of this patent
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Abstract
Iron containing substrates are electrically polarized in a pre-plating composition which activates the surface of the steel substrate to receive thin tin or tin alloy. The thin tin or tin alloy is electroplated onto the activate surface of the steel substrate. The thin tinplate and alloy have reduced amounts of pores in the surface.
Claims9
A method comprising:
- a) providing a steel substrate;
- b) contacting the steel substrate with a pre-plating composition comprising one or more organic sulfonic acids, salts or anhydrides thereof and one or more grain refiners;
- c) electrolytically polarizing the steel substrate;
- and
- d) electrolytically plating tin or tin alloy layer on the steel substrate.
2 more elements
Dependencies are inferred from the claim text.