Stacked packages using laser direct structuring
AssigneeFlextronics AP, LLC
InventorsSamuel TAM, Bryan LEE SIK PONG, Dick PANG
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Abstract
Described herein is a stacked package using laser direct structuring. The stacked package includes a die attached to a substrate. The die is encapsulated with a laser direct structuring mold material. The laser direct structuring mold material is laser activated to form circuit traces on the top and side surfaces of the laser direct structuring mold material. The circuit traces then undergo metallization. A package is then attached to the metalized circuit traces and is electrically connected to the substrate via the metalized circuit traces.
Claims12
A laser direct structuring (LDS) stacked package, comprising:
- a substrate;
- a LDS mold material covered die attached to the substrate, wherein at least one surface of the LDS mold material has metalized circuit traces;
- and
- a package attached to the metalized circuit traces.
An electronic device, comprising:
- a substrate having a top surface and a bottom surface;
- a laser direct structuring (LDS) mold material covered die attached to the top surface of the substrate, wherein at least one surface of the LDS mold material has metalized circuit traces;
- and
- a package attached to the metalized circuit traces.
Dependencies are inferred from the claim text.