Heat radiating substrate and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYoung Ki Lee, Bum Seok Suh, Chang Seob Hong, Joon Seok Chae, Kwang Soo Kim
Life of this patent
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Abstract
Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.
Claims13
A heat radiating substrate comprising:
- a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other;
- a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern;
- and
- an insulating layer formed between the heat radiating plate and the conductor pattern layer.
A method of manufacturing a heat radiating substrate, comprising:
- preparing a heat radiating base plate;
- forming a heat radiating plate by forming a step at the bottom of the heat radiating base plate so that one side and the other side of the heat radiating base plate have thicknesses different from each other;
- forming an insulating layer on the heat radiating plate;
- and
- forming a conductor pattern layer on the insulating layer, the conductor pattern layer including a mounting pad on which a control device and a power device are mounted and a circuit pattern.
Dependencies are inferred from the claim text.