US 2014/0110154 A1 · BUS APPARATUS FOR USE WITH CIRCUIT INTERRUPTERS OR OTHER DEVICES

Abstract

An improved bus apparatus includes a generally rigid substrate and a conductor apparatus. The conductor apparatus includes a number of bus elements that are embedded within the substrate and which are electrically connected with connection elements that each have an end that is situated external to the substrate. Additional connection elements extend through the substrate and are connectable with loads. Circuit interrupters and other devices are connectable with pairs of the connector elements, wherein one connector element is connected with a line and wherein another connector element is connected with a load. The bus apparatus is formed by receiving the bus elements in channels formed in layers of a thermally conductive and electrically insulative material, and the layers are bonded together with the use of a bonding material to cause the bus elements to become laminated within the interior of the substrate.

Claims15

Dependent claims

A bus apparatus that is structured to enable a number of circuit interrupters or other devices to be electrically connected with a number of circuits, the bus apparatus comprising:

a substrate formed of a material that is structured to be electrically resistive and thermally conductive within the ranges of voltage and temperature in which the bus apparatus is structured to typically operate;
and
a conductor apparatus comprising:
at least a first conductor assembly that comprises an electrically conductive first bus element and a number of electrically conductive first connection elements, at least some of the number of first connection elements each having an electrical connection with the first bus element, the first bus element being embedded within the substrate, the least some of the number of first connection elements each extending from the electrical connection with the first bus element and having at least one end situated external to the substrate, and
a number of electrically conductive additional connection elements extending through the substrate and being electrically unconnected with the first bus element within the substrate, at least some of the number of additional connection elements each having at least one end situated external to the substrate.

2 more elements

A method of forming a bus apparatus that is structured to enable a number of circuit interrupters or other devices to be electrically connected with a number of circuits, the bus apparatus comprising a substrate having a plurality of layers, a conductor apparatus comprising a number of conductor assemblies, each conductor assembly comprising an electrically conductive bus element, a number of electrically conductive connection elements, and a number of electrically conductive additional connection elements, the substrate being formed of a material that is structured to be electrically resistive and thermally conductive within the ranges of voltage and temperature in which the bus apparatus is structured to typically operate, the method comprising:

situating on each of at least some of the layers of the plurality of layers a conductor assembly of the number of conductor assemblies;
interposing between the layers of each adjacent pair of layers of the plurality of layers a bonding material;
and
subjecting the plurality of layers and the bonding material to a formation process that comprises an application for a period of time of at least one of compression and temperature in excess of ambient conditions to bond together the plurality of layers.

1 more element

Dependencies are inferred from the claim text.

Bus apparatus for use with circuit interrupters or other devices

Life of this patent

Bus apparatus for use with circuit interrupters or other devices

Life of this patent

Abstract

Claims15