Printed circuit board and method for manufacturing same

A method for manufacturing a printed circuit board, comprising:

• providing a first circuit board and a second circuit board, the first circuit substrate comprising a first insulation layer, a first inner electrically conductive pattern layer, and a first copper foil, the second circuit substrate comprising a second insulation layer, a second inner electrically conductive pattern layer, and a second copper foil, the second circuit substrate comprising at least one marking region, the marking region consisting of the second insulation layer and the second copper foil;
• attaching a connection adhesive sheet on the first inner electrically conductive pattern layer and the surface of the first circuit substrate exposed at the first inner electrically conductive pattern layer, and defining at least one through hole in the first circuit substrate, the through hole passing through the connection adhesive sheet and the first circuit substrate, and spatially corresponding to the at least marking region;
• laminating the first circuit substrate onto the second circuit substrate, such that the connection adhesive sheet is sandwiched between the first circuit substrate and the second circuit substrate, and the through hole aligned with the marking region;
• and
• converting the first copper foil into a first outer electrically conductive pattern layer, and converting the second copper foil into a second outer electrically conductive pattern layer with at least one identification mark, the identification mark being arranged in the marking region, the first outer electrically conductive pattern layer comprising a plurality of first gold fingers, the second outer electrically conductive pattern layer comprising a plurality of second gold fingers.