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US 2014/0110090 A1Published application
Heat dissipation device
AssigneeASUSTeK COMPUTER INC.
InventorsChen-Hsuan MA, Ing-Jer CHIOU
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AssigneeASUSTeK COMPUTER INC.
InventorsChen-Hsuan MA, Ing-Jer CHIOU
Estimating the term…
A heat dissipation device is provided. The heat dissipation device is applied to an electronic device with a first heat source and a second heat source. The heat dissipation device includes a housing, an impeller, a first heat conductive assembly, a second heat conductive assembly and an switch. The housing includes an accommodating space, a first outlet and a second outlet. The first outlet and the second outlet are connected to and through the accommodating space. The impeller is disposed in the accommodating space. The first heat conductive assembly is connected to the first outlet and the first heat source. The second heat conductive assembly is connected to the second outlet and the second heat source. The switch is disposed at the first outlet to open or dose the first outlet.
A heat dissipation device, applied to an electronic device with a first heat source and a second heat source, the heat dissipation device comprising:
The heat dissipation device according to claim I, wherein the switch includes:
Dependencies are inferred from the claim text.