Bonding apparatus and method of bonding component on substrate using the same
AssigneeSamsung Display Co., Ltd.
InventorsMin-Woo LEE, Nakcho CHOI, DAEHO SONG, WooJae LEE
Life of this patent
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Abstract
A bonding apparatus configured to bond a component on a substrate is presented. The apparatus includes a stage, a push member, a support member and a compression member. The stage fixes the substrate in place and by using at least one first suction part formed in the stage. The push member is disposed above the stage and pushes the substrate fixed to the stage to support the substrate on the stage. At least one second suction part is formed in the support member to attach to a pad part of the substrate. The compression member compresses the component into the pad part fixed to the support member.
Claims20
A bonding apparatus configured to bond a component to a substrate comprising:
- a stage holding the substrate in a fixed position using at least one first suction part formed in the stage;
- a push member supporting the substrate on the stage by pushing the substrate that is fixed to the stage, the push member being disposed on the stage;
- a support member fixing a pad part of the substrate using at least one second suction part formed in the support member;
- and
- a compression member compressing the component into the pad part that is fixed to the support member.
A method of bonding a component to a substrate comprising:
- holding the substrate in a fixed position by using a stage;
- fixing the substrate to the stage using at least one first suction part extending through the stage;
- supporting the substrate on the stage by pushing the substrate by a push member;
- providing a pad part of the substrate onto the support member;
- fixing the pad part to the support member using at least one second suction part formed in the support member;
- providing the component onto the pad part fixed to the support member;
- and
- compressing the component into the pad part using a compression member.
Dependencies are inferred from the claim text.