Retention device and retention method
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorAtsushi Miyanari
Life of this patent
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Abstract
A holding device including a first sucking section for sucking a wafer (substrate) from a side on which a dicing tape (supporting film) is adhered; a structure that supports a dicing frame (frame part) and covers a first region which (i) is on a surface of the dicing tape to which surface the wafer is not adhered and (ii) is between the wafer and the dicing frame; and a second sucking section for sealing a boundary between the structure and at least one of the dicing frame and the first region.
Claims18
A holding device for holding a substrate which is adhered to a center part of a supporting film having a frame part at its outer edge, said holding device comprising:
- first sucking means for sucking the substrate from a side on which the supporting film is adhered;
- a structure that supports the frame part and covers a first region which (i) is on a surface of the supporting film to which surface the substrate is not adhered and (ii) is between the substrate and the frame part;
- and
- sealing means for sealing a boundary between the structure and at least one of the frame part and the first region.
A method for holding a substrate which is adhered to a center part of a supporting film having a frame part at its outer edge, said method comprising:
- sucking the substrate from a side on which the supporting film is adhered;
- covering, with a structure, a first region which (i) is on a surface of the supporting film to which surface the substrate is not adhered and (ii) is between the substrate and the frame part;
- and
- sealing a boundary between the structure and at least one of the frame part and the first region.
A holding device for holding a substrate which is adhered to a center part of a supporting film having a frame part at its outer edge, said holding device comprising:
- first sucking means for sucking the substrate from a side on which the supporting film is adhered;
- a structure that supports the frame part and covers a first region which (i) is on a surface of the supporting film to which surface the substrate is not adhered and (ii) is between the substrate and the frame part;
- sealing means for sealing a boundary between the structure and at least one of the frame part and the first region;
- solvent adding means for adding a solvent to a surface of the substrate to which surface the supporting film is not adhered;
- and
- rotating means for rotating the substrate in an in-plane direction of a substrate surface of the substrate while the substrate is being sucked by the first sucking means,
- said holding device serving as a cleaning device for cleaning the substrate,
- wherein:
- the sealing means includes second sucking means for sucking at least one of the frame part and the first region;
- the second sucking means is provided on the structure;
- in a case where the substrate is horizontally placed, the structure supports the frame part such that the frame part is located lower than the substrate;
- and
- a surface of the structure, which surface faces the first region, includes a surface that inclines downwards with respect to a substrate surface of the substrate.
Dependencies are inferred from the claim text.