Deposition apparatus
AssigneeASM IP Holding B.V.
InventorsKi Jong KIM, Dae Youn Kim, Hyun Soo Jang
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Abstract
In a deposition apparatus, as a plurality of plasma connection terminals that transfer plasma power to a plasma electrode are coupled in parallel to the plasma electrode, resistance caused by the plurality of plasma connection terminals is reduced and a current is distributed such that heat generated in the plurality of plasma connection terminals can be distributed. Therefore, even if high RF power is used, by preventing the plurality of plasma connection terminals from being oxidized, plasma is stably supplied and thus, stability of a deposition apparatus and the accuracy of a process can be enhanced.
Claims10
A deposition apparatus, comprising:
- a substrate support;
- a plasma electrode coupled to the substrate support such that the coupled substrate support and plasma electrode define a reaction space;
- a plasma power source portion that supplies plasma power to the plasma electrode;
- and
- a plurality of plasma connection terminals that are connected between the plasma power source portion and the plasma electrode.
Dependencies are inferred from the claim text.