Method and Apparatus for Cutting a Substrate
AssigneeThe Procter & Gamble Company
InventorsUwe SCHNEIDER, Daniel Patrick FINDLEY
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AssigneeThe Procter & Gamble Company
InventorsUwe SCHNEIDER, Daniel Patrick FINDLEY
Estimating the term…
A rotary cutting apparatus is configured to rotate about a first longitudinal axis. The cutting roll includes a cutting member. The apparatus includes an anvil roll that is configured to rotate about a second longitudinal axis. The anvil roll is positioned relative to the cutting roll such that the first longitudinal axis is substantially parallel with the second longitudinal axis. The anvil roll includes an outer circumferential surface. The second longitudinal axis is selectively movable between a first position and a second position relative to the first longitudinal axis. In the first position, a first minimum distance is defined between the first longitudinal axis and the second longitudinal axis. In the second position, a second minimum distance is defined between the first longitudinal axis and the second longitudinal axis, and wherein the second minimum distance is greater than the first minimum distance.
A rotary cutting apparatus selectively configurable to operate in a substrate cutting configuration and a substrate bypass configuration comprising:
A method comprising the steps of:
A method comprising the steps of:
Dependencies are inferred from the claim text.