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US 2014/0109696 A1Published application
Pressure sensing device and clipping apparatus using the same
AssigneeIndustrial Technology Research Institute
InventorsChang-Yi CHEN, Wen-Ching KO, Kuo-Hua TSENG
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Abstract
A pressure sensing device and a clipping apparatus using the same are provided. The pressure sensing device includes a pressure sensing layer and a bump structure. The bump structure is disposed at one side of the pressure sensing layer. A parallel cross-sectional plane of the bump structure gradually becomes small along a direction. The parallel cross-sectional plane is substantially parallel to the pressure sensing layer.
Claims16
A pressure sensing device, comprising:
- a pressure sensing layer;
- and
- at least one bump structure disposed at one side of the pressure sensing layer, wherein a parallel cross-sectional plane of the bump structure gradually becomes small along a direction, and the parallel cross-sectional plane is substantially parallel to the pressure sensing layer.
A clipping apparatus, comprising:
- a clip;
- a plurality of the pressure sensing devices disposed on the clip, wherein each pressure sensing device comprises:
- a pressure sensing layer;
- and
- at least one bump structure disposed at one side of the pressure sensing layer, wherein a parallel cross-sectional plane of the bump structure gradually becomes small along a direction, and the parallel cross-sectional plane is substantially parallel to the pressure sensing layer;
- and
- a control unit controlling a clipping force of the clip according to a plurality of pressure signals of the pressure sensing devices.
4 more elements
Dependencies are inferred from the claim text.