Pressure sensing device and manufacturing method of the same
AssigneeDenso Corporation
InventorMakoto Sakai
Life of this patent
Estimating the term…
Abstract
A pressure sensing device includes a sensor chip having a sensing portion, a bonding wire electrically connected with the sensor chip, a protection section, and a package. The sensor chip detects a pressure with the sensing portion and generates a signal corresponding to the detected pressure. The protection section includes a first protection section and a second protection section. The first protection section includes a predetermined portion, which seals the sensing portion, and a remaining portion other than the predetermined portion. The second protection section is arranged on the remaining portion of the first protection section and seals at least the bonding wire so that the bonding wire is not exposed to an outside.
Claims7
A pressure sensing device comprising:
- a sensor chip having a sensing portion, the sensor chip detecting a pressure with the sensing portion and generating a signal corresponding to the pressure detected by the sensing portion;
- a bonding wire that is electrically connected with the sensor chip in order to transmit the signal generated by the sensor chip;
- a protection section having an electrical insulation property and sealing the sensor chip and the bonding wire;
- and
- a package, in which the sensor chip, the bonding wire, and the protection section are arranged,
- wherein the protection section includes:
- a first protection section that has a predetermined portion and a remaining portion other than the predetermined portion, the predetermined portion sealing the sensing portion of the sensor chip;
- and
- a second protection section arranged on the remaining portion of the first protection section and sealing at least the bonding wire so that the bonding wire is not exposed to an outside.
Dependencies are inferred from the claim text.