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US 2014/0109432 A1Published application
Multi-step system and method for curing a dielectric film
AssigneeTokyo Electron Limited
InventorsJunjun LIU, Eric M. LEE, Dorel L. TOMA
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Abstract
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.
Claims1
A method of treating a dielectric film on a substrate, comprising:
- disposing said substrate in a drying system;
- drying said dielectric film according to a drying process in order to remove or partially remove contaminants on or in said dielectric film;
- transferring said substrate from said drying system to a curing system while maintaining vacuum conditions during said transfer;
- and
- curing said dielectric film by:
- exposing said dielectric film to UV radiation, and
- exposing said dielectric film to IR radiation.
4 more elements
Dependencies are inferred from the claim text.