Iodine-based etching solution and etching method
AssigneeKanto Kagaku Kabushiki Kaisha
InventorsKazuaki Nagashima, Hideki Takahashi
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Abstract
Technical Problem The present invention aims to provide an iodine-based etching solution having a high ratio of etching rate of a palladium material to that of a metal material other than the palladium material, in particular, an iodine-based etching solution capable of relatively decreasing the concentration of an organic solvent in the etching solution. Solution to Problem The iodine-based etching solution of the present invention is an iodine-based etching solution to etch a material in which a palladium material and a metal material other than the palladium material coexist, and comprises a water-compatible organic solvent and a water-soluble polymer compound.
Claims13
An iodine-based etching solution to etch a material in which a palladium material and a metal material other than the palladium material coexist, comprising a water-compatible organic solvent and a water-soluble polymer compound.
A method of etching a material in which a palladium material and a metal material other than the palladium material coexist using an iodine-based etching solution,
- wherein the iodine-based etching solution comprises a water-compatible organic solvent and a water-soluble polymer compound,
- wherein the method comprises a step of adjusting the ratio of etching rate of the palladium material to that of the metal material by adjusting the content (s) of the organic solvent and/or the water-soluble polymer compound in the iodine-based etching solution.
Dependencies are inferred from the claim text.