Glass-filled polyamide composition and article
AssigneeSabic Innovative Plastics IP B.V.
InventorsSnezana Grcev, Hans Fortuijn
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Abstract
A composition useful for molding electrical components is prepared by melt blending specific amounts of components including a polyamide, a poly(phenylene ether)-polysiloxane block copolymer reaction product including a poly(phenylene ether) and a poly(phenylene ether)-polysiloxane block copolymer, a flame retardant including a metal dialkylphosphinate, melamine polyphosphate, and zinc borate, and glass fibers. The use of a poly(phenylene ether)-polysiloxane block copolymer reaction product rather than a poly(phenylene ether) alone provides improved surface resistivity without sacrificing flame retardancy.
Claims17
A composition comprising the product of melt blending:
- 30 to 89 weight percent of a polyamide;
- 1 to 15 weight percent of a poly(phenylene ether)-polysiloxane block copolymer reaction product comprising a poly(phenylene ether) and a poly(phenylene ether)-polysiloxane block copolymer;
- 5 to 25 weight percent of a flame retardant comprising
- 4 to 16 weight percent of a metal dialkylphosphinate,
- 0.9 to 8 weight percent of melamine polyphosphate, and
- 0.1 to 3 weight percent of zinc borate;
- 5 to 45 weight percent of glass fibers;
- and
- 0 to 15 weight percent of a surface-treated Boehmite;
- wherein the composition comprises 5 to 20 weight percent of the flame retardant when the composition comprises 5 to 15 weight percent of the surface-treated Boehmite;
- wherein the composition comprises greater than 10 to 25 weight percent of the flame retardant when the composition comprises 0 to less than 5 weight percent of the surface-treated Boehmite;
- and
- wherein all weight percents are based on the total weight of the composition.
Dependencies are inferred from the claim text.