Clip assembly and heat dissipation device incorporating the same

A heat dissipation device for dissipating heat generated by an electronic component mounted on a printed circuit board, the heat dissipation device comprising:

• a heat sink;
• and
• a clip assembly spanning the heat sink and securing the heat sink on the printed circuit board, the clip assembly comprising a wire clip and two fasteners engaging with the wire clip, the wire clip comprising a main body and two engaging arms extending outwardly from two ends of the main body, respectively, each engaging arm comprising a first section extending outwardly from the main body, a second section opposite to the first section, an engaging portion interconnecting the first section with the second section, and a hook bent outwardly from a free end of the second section;
• wherein the main body and the hook of each engaging arm of the wire clip are hooked on the heat sink, and each fastener extends through the engaging portion of a corresponding engaging arm and is screwed into the printed circuit board, the engaging portions of the wire clip are resiliently pressed by the fasteners, and the heat sink is pressed downwardly by the main body of the wire clip.