Clip assembly and heat dissipation device incorporating the same

A heat dissipation device for dissipating heat generated by an electronic component mounted on a printed circuit board, the heat dissipation device comprising:

• a heat sink;
• and
• a clip assembly pressing the heat sink towards the electronic component, the clip assembly comprising two wire clips and two fasteners engaging with the wire clips, respectively, each wire clip comprising two opposite engaging arms, and an engaging section interconnecting the two engaging arms, each engaging arm comprising a connecting section extending outwardly from the engaging section, and a hook bent outwardly from a free end of the connecting section;
• wherein the hooks of each wire clip are hooked in the heat sink, each fastener extends through the engaging section of the corresponding wire clip and is screwed into the printed circuit board, the engaging section of the wire clip is resiliently pressed by the fastener, and the heat sink is pressed downwardly by the connecting section of the wire clip.