Back to results
US 2014/0053977 A1Published application
Pressure-sensitive adhesive tape and method using the tape
AssigneeNitto Denko Corporation
InventorsTokuhisa KOSAKA, Akiko NONAKA, Shinji INOKUCHI
Life of this patent
Estimating the term…
Abstract
A pressure-sensitive adhesive tape that can be used in a temperature environment of at least 90° C. or higher, includes: a pressure-sensitive adhesive layer; and a release liner provided on the surface on at least one side of the pressure-sensitive adhesive layer. The release liner has: a base layer containing a polyolefin resin; and a release layer that contains low-density polyethylene and is provided on at least one side of the base layer to be in contact with the pressure-sensitive adhesive layer.
Claims19
A method of using a pressure-sensitive adhesive tape, wherein
- the pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer and a release liner provided on a surface on at least one side of the pressure-sensitive adhesive layer is used in a temperature environment of 90° C. or higher and in a state where a surface on the other side of the pressure-sensitive adhesive layer is attached to an adherend while the release liner is being attached to the surface on the one side of the pressure-sensitive adhesive layer, and wherein
- the release liner has:
- a base layer containing a polyolefin resin;
- and a release layer that contains low-density polyethylene and is provided on at least one side of the base layer to be in contact with the pressure-sensitive adhesive layer.
1 more element
Dependencies are inferred from the claim text.