Methods and apparatus for nanolapping
OwnerVictor B. Kleyinventor
Life of this patent
Estimating the term…
Abstract
A lapping system for lapping portions of a workpiece. The lapping system includes, a lap that is defined by a surface. Portions of the surface are a lapping surface. The lapping surface has a coating that enhances material removal from a workpiece in a lapping process. The lapping system further includes, a scanning probe microscope having a tip and a substrate. The scanning probe microscope controls lapping motion of the lap and workpiece.
Claims16
A lapping system for lapping portions of a workpiece, the system comprising:
- a lap being defined by a surface, wherein portions of the surface are a lapping surface;
- and wherein the lapping surface has a coating;
- wherein the coating enhances material removal from a workpiece in a lapping process;
- and
- a scanning probe microscope having a tip and a substrate;
- wherein the scanning probe microscope controls lapping motion of the lap and workpiece.
4-17. (canceled)
A lap having a lapping surface for lapping portions of a workpiece, the lap comprising:
- a plurality of lap segments, wherein each lap segment has a lapping surface;
- and wherein the lapping surfaces of the lap segments are oriented to form the lapping surface of the lap.
19-21. (canceled)
The lap of claim 20 wherein the lapping surface of the lap is a track having a polygonal shape;
- and
- the track is bounded by a space defined by a cube having edge dimensions of about 200 μm or less.
A method of fabricating a lap, the method comprising:
- cutting a silicon wafer along the 110 crystallographic plane;
- etching a track of a first shape in the silicon wafer, the track has a first sidewall, a second sidewall, and a bottom surface, the first and second of sidewalls being approximately perpendicular to a top surface of the silicon wafer;
- cutting the silicon wafer in a plurality of pieces;
- and
- arranging the plurality of pieces to form the lap;
- wherein the lap has another track having second shape;
- and
- the other track is a lapping surface
25-27. (canceled)
A lap having a lapping surface for imparting shape onto portions of a workpiece, the lap comprising:
- a body;
- and
- a set of surface portions bounding the body;
- wherein the lapping surface is comprised of a subset of the surface portions;
- and
- the lapping surface is bounded by a space defined by a space defined by a cube having edge dimensions of about 200 μm or less.
31-86. (canceled)
A lapping method for lapping portions of a workpiece, the method comprising:
- controlling movement of the workpiece and a first lap relative to each other with a scanning probe microscope;
- controlling movement of the workpiece and a second lap relative to each other with a scanning probe microscope;
- lapping the workpiece into a first shape with the first lap;
- and
- lapping the workpiece into a second shape with the second lap.
88-122. (canceled)
Dependencies are inferred from the claim text.