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US 2014/0042564 A1Published application
Integrated-circuit switch
OwnerChou-Hsien Tsai, Chia-Chin Suinventors
Life of this patent
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Abstract
A switch and the manufacturing method thereof are provided. The switch comprises a chip structure providing a one-piece bonding surface. An actuating member of a mechanical switch could receive an external force to contact the one-piece bonding surface so as to actuate the chip structure.
Claims26
An integrated-circuit switch, comprising a chip structure having a one-piece bonding surface in contact with an actuating member, wherein the chip structure comprises:
- a protective fixture;
- a grain disposed in the protective fixture, wherein the grain is actuated as a result of contact with the actuating member;
- and
- a coupling member disposed in the protective fixture and coupled with the grain, wherein the one-piece bonding surface is at least provided by the coupling member.
1 more element
A manufacturing method for a switch, comprising the following steps of:
- forming a chip structure having a one-piece bonding surface;
- and
- assembling an actuating member and the chip structure;
- wherein the actuating member is assembled to the one-piece bonding surface, and the actuating member has an operating area exposed outside the switch for receiving an external force.
1 more element
A switch, comprising:
- a chip structure, comprising:
- a protective fixture;
- a grain disposed in the protective fixture;
- and
- a coupling member disposed in the protective structure and electrically connected with the grain;
- and
- an actuating member limited by the protective fixture and actuating the chip structure, wherein the actuating member is subjected to an external force to so as to contact both of the grain and the coupling member or contact either of the grain and the coupling member.
4 more elements
-75. (canceled)
Dependencies are inferred from the claim text.