US 2014/0035136 A1 · Embedded Package Security Tamper Mesh

Abstract

Systems and methods for embedded tamper mesh protection are provided. The embedded tamper mesh includes a series of protection bond wires surrounding bond wires carrying sensitive signals. The protection bond wires are positioned to be vertically higher than the signal bond wires. The protection wires may be bonded to outer contacts on the substrate while the signal bond wires are bonded to inner contacts, thereby creating a bond wire cage around the signal wires. Methods and systems for providing package level protection are also provided. An exemplary secure package includes a substrate having multiple contacts surrounding a die disposed on an upper surface of the substrate. A mesh die including a series of mesh die pads is coupled to the upper surface of the die. Bond wires are coupled from the mesh die pads to contacts on the substrate thereby creating a bond wire cage surrounding the die.

Claims10

Dependent claims

A secure integrated circuit package, comprising:

a substrate including a plurality of outer contacts disposed on an upper surface of the substrate;
a die coupled to the upper surface of the substrate;
a mesh die including a mesh protection grid, the mesh die coupled to an upper surface of the die, wherein the mesh die include a plurality of mesh die pads disposed in a ring on an upper surface of the mesh die;
and
a plurality of bond wires, wherein each bond wire connects a mesh die pad to an outer contact thereby creating a cage of bond wires surrounding the die.

2 more elements

Dependencies are inferred from the claim text.

Embedded Package Security Tamper Mesh

Life of this patent

Embedded Package Security Tamper Mesh

Life of this patent

Abstract

Claims10