Back to results
US 2014/0005353 A1Published application
Polyamide compound and molded article thereof
AssigneeCanon Kabushiki Kaisha
InventorsKie Yutaka, Toshinari Miura, Katsuhiro Matsuda, Takeshi Komuro
Life of this patent
Estimating the term…
Abstract
Provided is a polyamide compound containing a plant-derived component which has high heat resistance and good moldability. The polyamide compound is represented by the following general formula (1) and has a weight-average molecular weight of 5,000 or more and 200,000 or less: in the formula (1), m represents 2 or 3, and each end of the polymer is one of a hydroxyl group and hydrogen.
Claims4
A polyamide compound of the following general formula (1) having a weight-average molecular weight of 5,000 or more and 200,000 or less:
- in the formula (1), m represents 2 or 3, and each end of the polymer is one of a hydroxyl group and hydrogen.
Dependencies are inferred from the claim text.