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US 2014/0005328 A1Published application
Polyamide-imide resin composition, polyamide-imide resin film using the resin composition, and seamless belt including the resin film
AssigneeNitto Denko Corporation
InventorsShunsuke MASAKI, Hisae KITAGAWA
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Abstract
A polyamide-imide resin composition according to embodiment of the present invention, including a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other, wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %.
Claims8
A polyamide-imide resin composition, comprising a polyamide-imide resin obtained by causing acid components (A) containing a dimer acid and a polyisocyanate component (B) to react with each other, wherein a ratio of the dimer acid in the acid components (A) is 3 mol % to 55 mol %.
Dependencies are inferred from the claim text.