Epoxy resin composition, method for producing same, and semiconductor device using same
AssigneeToray Industries, Inc.
InventorsSayaka Takeda, Masao Tomikawa
Life of this patent
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Abstract
Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.
Claims9
An epoxy resin composition comprising a compound (a) having an imide structure represented by the Formula (1), and a compound (b) having at least two epoxy groups, wherein the compound (a) having an imide structure represented by the Formula (1) has a number average molecular weight of 1,000 to 5,000:
- (wherein R1 has a structure represented by the Formula (2) in an amount of not less than 50%;
- R2 is selected from the Formulae (4) below wherein different R2s are optionally employed in combination;
- the benzene ring in any structures selected from the Formulae (4) below is optionally substituted by one or more groups selected from the group consisting of hydroxyl group, C1-C4 alkyl groups, C1-C4 fluoroalkyl groups, C1-C4 alkoxyl groups, C1-C4 fluoroalkoxyl groups, C2-C5 ester groups, carboxyl group, cyano group and nitro group;
- v is an integer of 1 to 8;
- and G is selected from the Formulae (5) below wherein different Gs are optionally employed in combination);
- (wherein R4 and R5 are each independently selected from the group consisting of C1-C4 alkyl groups, C1-C4 fluoroalkyl groups, C1-C4 alkoxyl groups, C1-C4 fluoroalkoxyl groups, C2-C5 ester groups, carboxyl group, cyano group and nitro group wherein these groups are optionally employed individually or different groups are optionally employed in combination as each of R4 and R5;
- X is selected from the group consisting of direct bond, —CH2—, —C(CH3)2—, —C(CF3)2—, —C(C2 F5)2—, —O—, —SO2—, fluorene, —CO—, —COO—, —CF2— and the Formulae (3) to (5) below wherein different Xs are optionally employed in combination;
- p and q are integers of 0 to 3, s and t are integers of 0 to 4, and s+t>0;
- and w is an integer of 0 to 8);
A method for producing an epoxy resin composition, the method comprising the steps of:
- mixing a diamine having a structure represented by the Formula (2)' below in an amount of not less than 50% by mole, one or more tetracarboxylic anhydrides selected from the Formulae (4)′ below, and one or more compounds selected from the Formulae (5)′ below in a solvent (c)′ having a ketone group under the condition of 50 to 80° C. for 0.5 to 2 hours to obtain a compound (a) having an imide structure represented by the Formula (1);
- and
- mixing the compound (a) with a compound (b) having at least two epoxy groups.
- (wherein R4 and R5 are each independently selected from the group consisting of C1-C4 alkyl groups, C1-C4 fluoroalkyl groups, C1-C4 alkoxyl groups, C1-C4 fluoroalkoxyl groups, C2-C5 ester groups, carboxyl group, cyano group and nitro group wherein these groups are optionally employed individually or different groups are optionally employed in combination as each of R4 and R5;
- X is selected from the group consisting of direct bond, —CH2—, —C(CH3)2—, —C(CF3)2−, —C(C2 F5)2—, —O—, —SO2—, fluorene, —CO—, —COO—, —CONH—, —CF2— and the Formula (3) below wherein different Xs are optionally employed in combination;
- p and q are integers of 0 to 3, s and t are integers of 0 to 4 and s+t>0;
- and w is an integer of 0 to 8);
- (wherein R1 has a structure represented by the Formula (2) in an amount of not less than 50%;
- R2 is selected from the Formulae (4) below wherein different R2s are optionally employed in combination;
- the benzene ring in any structures selected from the Formulae (4) below is optionally substituted by one or more groups selected from the group consisting of hydroxyl group, C1-C4 alkyl groups, C1-C4 fluoroalkyl groups, C1-C4 alkoxyl groups, C1-C4 fluoroalkoxyl groups, C2-C5 ester groups, carboxyl group, cyano group and nitro group;
- v is an integer of 1 to 8;
- and G is selected from the Formulae (5) below wherein different Gs are optionally employed in combination)
- (wherein R4 and R5 are each independently selected from the group consisting of C1-C4 alkyl groups, C1-C4 fluoroalkyl groups, C1-C4 alkoxyl groups, C1-C4 fluoroalkoxyl groups, C2-C5 ester groups, carboxyl group, cyano group and nitro group wherein these groups are optionally employed individually or different groups are optionally employed in combination as each of R4 and R5;
- X is selected from the group consisting of direct bond, —CH2—, —C(CH3)2—, —C(CF3)2—, —C(C2 F5)2—, —O—, —SO2—, fluorene, —CO—, —COO—, —CONH—, —CF2— and the Formula (3) below wherein different Xs are optionally employed in combination;
- p and q are integers of 0 to 3, s and t are integers of 0 to 4 and s+t>0;
- and w is an integer of 0 to 8)
Dependencies are inferred from the claim text.