Polishing pad and chemical mechanical polishing apparatus for polishing a workpiece, and method of polishing a workpiece using the chemical mechanical polishing apparatus
AssigneeEbara Corporation
InventorsYu ISHII, Kenya ITO, Shozo TAKAHASHI, Mika SUZUKI
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Abstract
A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.
Claims31
A polishing pad for polishing a workpiece, the polishing pad comprising:
- an elastic pad having a polishing surface;
- a deformable base layer that supports the elastic pad;
- and
- an adhesive layer that joins the elastic pad to the base layer.
A chemical mechanical polishing apparatus for polishing a workpiece, comprising:
- a rotatable polishing table for supporting a polishing pad;
- a carrier configured to press a workpiece against the polishing pad;
- a rotating device configured to rotate the carrier about its own axis;
- and
- a polishing liquid supply mechanism configured to supply a polishing liquid onto the polishing pad,
- wherein the carrier includes a pivot mechanism configured to cause the workpiece to pivot, and
- wherein the pivot mechanism includes
- a workpiece holder configured to hold the workpiece, and
- a rotary actuator configured to cause the workpiece holder to pivot about a predetermined pivot axis through a predetermined angle with the workpiece placed in contact with the polishing pad.
A chemical mechanical polishing apparatus for polishing a workpiece, comprising:
- a rotatable polishing table for supporting a polishing pad;
- a carrier configured to press a workpiece against the polishing pad;
- a rotating device configured to rotate the carrier about its own axis;
- and
- a polishing liquid supply mechanism configured to supply a polishing liquid onto the polishing pad,
- wherein the carrier includes
- a workpiece holder configured to hold the workpiece,
- a rotary actuator configured to rotate the workpiece, held by the workpiece holder, about a central axis of the workpiece at a preset speed, and
- a vertically moving mechanism configured to move the workpiece up and down in synchronization with the rotation of the workpiece.
Dependencies are inferred from the claim text.