Method for improving polyimide non-adherence to substrate

Abstract

Disclosed is a method for improving polyimide (PI) non-adherence to a substrate and a PI solution. The method includes the following steps: (1) providing a substrate and a PI solution, the PI solution comprising PI molecules and a solvent, the PI molecules having hydrophobic moieties; and (2) coating the PI solution on the substrate to form a PI film. The PI solution includes PI molecules and a solvent. The PI molecules have hydrophobic moieties. The solvent includes N-methyl-2-pyrrolidone, γ-butyrolactone, butyl carbonate, or a mixture thereof. The PI molecules of the PI solution contain hydrophobic moieties and in coating the PI solution to a substrate, the hydrophobic moieties link with organic compounds on the substrate thereby enhancing affinity of the PI solution with surface of the substrate, improving the issue of PI non-adherence, and the heightening quality of printing the substrate.

Dependencies are inferred from the claim text.