Substrate processing apparatus, substrate supporter and method of manufacturing semiconductor device
AssigneeHitachi Kokusai Electric Inc.
InventorsMasakazu Sakata, Hidehiro Yanai
Life of this patent
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Abstract
A substrate processing apparatus of the present invention includes a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face; a heating element arranged in the substrate placement stage and configured to heat the substrate; a plurality of struts configured to support the flange from below, and an exhaust unit configured to exhaust an atmosphere in the process chamber, wherein the supporting member is provided between the substrate placement stage and the plurality of struts.
Claims10
A substrate processing apparatus, comprising:
- a process chamber configured to process a substrate:
- a gas supply unit configured to supply a processing gas into the process chamber;
- a substrate placement stage installed in the process chamber, and configured to place the substrate on a substrate placement surface, with a flange provided on its side face;
- a heating element arranged in the substrate placement stage and configured to heat the substrate;
- a plurality of struts configured to support the flange from below, and
- an exhaust unit configured to exhaust an atmosphere in the process chamber,
- wherein the supporting member is provided between the substrate placement stage and the plurality of struts.
A substrate supporter, comprising:
- a substrate placement stage configured to place a substrate on a substrate placement surface, with a flange provided on its side face;
- a heating element arranged in the substrate placement stage, and configured to heat the substrate;
- and
- a plurality of struts configured to support the flange from below,
- wherein a supporting member is provided between the substrate placement stage and the plurality of struts.
A method of manufacturing a semiconductor device, comprising:
- loading a substrate into a process chamber;
- placing the substrate on a substrate placement surface of a substrate supporter including a substrate placement stage installed in the process chamber, with a flange provided on its side face and configured to place the substrate on the substrate placement surface, and a plurality of struts for supporting the flange from below, and a supporting member for supporting at least the flange between the substrate placement stage and the plurality of struts;
- processing the substrate by heating the substrate by the heating element while exhausting an inside of the process chamber by an exhaust unit, with the substrate placed on the substrate placement surface, and supplying a processing gas into the process chamber by a gas supply unit;
- and
- unloading the substrate after processing, from the process chamber.
Dependencies are inferred from the claim text.