Laser and plasma etch wafer dicing with a double sided uv-curable adhesive film

A method of dicing a semiconductor wafer comprising a plurality of integrated circuits, the method comprising:

• coupling a masked crystalline silicon substrate to a carrier substrate with a double-sided UV-curable adhesive film, a mask disposed on the silicon substrate covering and protecting the integrated circuits disposed on the silicon substrate;
• patterning the mask, at least a layer of silicon dioxide, a layer of low K material, and a layer of copper with a laser scribing process to expose regions of the silicon substrate between the integrated circuits;
• etching the silicon substrate through the exposed regions to form singulated integrated circuits;
• wherein exposing the UV-curable adhesive film to ultra-violet (UV) light to cure a first adhesive side more completely than a second adhesive side permits detaching the singulated integrated circuits from the partially-cured UV-curable adhesive film.

A system for dicing a semiconductor wafer, the semiconductor wafer comprising a plurality of integrated circuits, the system comprising:

• a deposition chamber to form a mask above the semiconductor wafer, the mask covering and protecting the integrated circuits disposed on a silicon substrate layer, the semiconductor wafer coupled to a carrier substrate with a double-sided ultraviolet (UV)-curable adhesive film;
• a laser scribe apparatus to pattern the mask disposed on the semiconductor wafer and at least a layer of silicon dioxide, a layer of low K material, and a layer of copper to expose regions of the silicon substrate between the integrated circuits;
• and
• a plasma etch chamber to etch the silicon substrate through the exposed regions to form singulated integrated circuits;
• wherein ultra-violet (UV) light is to irradiate the UV-curable adhesive film to cure a first adhesive side of the UV-curable adhesive film more completely than a second adhesive side to detach the singulated integrated circuits from the partially-cured UV-curable adhesive film.