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US 2014/0004679 A1Published application
Method of fabricating semiconductor device
AssigneeSK hynix Inc.
InventorsBeom-Yong KIM, Yun-Hyuck Ji, Seung-Mi Lee
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Abstract
A method for fabricating a semiconductor device includes forming a metal layer over a substrate, forming a capping layer over the metal layer, and densifying the metal layer through a heat treatment.
Claims20
A method for fabricating a semiconductor device, comprising:
- forming a metal layer over a substrate;
- forming a capping layer over the metal layer;
- and
- densifying the metal layer through a heat treatment.
1 more element
A method for fabricating a semiconductor device, comprising:
- forming a gate dielectric layer over a substrate;
- forming a metal layer over the gate dielectric layer;
- forming a capping layer over the metal layer;
- densifying the metal layer through a heat treatment;
- removing the capping layer;
- and
- forming a gate pattern by etching the metal layer and the gate dielectric layer.
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A method for fabricating a capacitor, comprising:
- forming a lower electrode;
- forming a dielectric layer over the lower electrode;
- forming an upper electrode metal layer over the dielectric layer;
- forming an upper electrode capping layer over the upper electrode metal layer;
- densifying the upper electrode metal layer through a first heat treatment;
- removing the upper electrode capping layer;
- and
- forming an upper electrode by etching the upper electrode metal layer.
5 more elements
Dependencies are inferred from the claim text.