Laser dicing method
AssigneeToshiba Kikai Kabushiki Kaisha
InventorShoichi SATO
Life of this patent
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Abstract
A laser dicing method of a work piece on a surface of which a metal film is provided, includes: a first metal film removing of irradiating a pulse laser beam defocused from the metal film, along a first line, and removing the metal film; a second metal film removing of irradiating the pulse laser beam defocused from the metal film, along a second line orthogonal to the first line, and removing the metal film; and a crack forming of irradiating the pulse laser beam in an area from which the metal film of the work piece is removed, and forming the crack in the work piece, and, in an area in which the first line and the second line cross, irradiation of the pulse laser beam is interrupted in the first metal film removing or the second metal film removing.
Claims17
A laser dicing method of a work piece on a surface of which a metal film is provided, the laser dicing method comprising:
- setting the work piece on a stage;
- a first metal film removing of irradiating a pulse laser beam defocused from the metal film, along a first line, and removing the metal film;
- a second metal film removing of irradiating the pulse laser beam defocused from the metal film, along a second line orthogonal to the first line, and removing the metal film;
- and a crack forming of irradiating the pulse laser beam in an area from which the metal film of the work piece is removed, and forming the crack in the work piece,
- wherein, in an area in which the first line and the second line cross, irradiation of the pulse laser beam is interrupted in one of the first metal film removing and the second metal film removing.
A laser dicing method comprising:
- setting the work piece on a stage;
- generating a clock signal;
- emitting the pulse laser beam synchronized with the clock signal;
- relatively moving the work piece and the pulse laser beam;
- switching irradiation and non-irradiation of the pulse laser beam on the work piece in light pulse units by controlling passing and blocking of the pulse laser beam using a pulse picker in synchronization with the clock signal;
- and
- forming a crack reaching a substrate surface of the work piece to be continuous in the substrate surface of the work piece by controlling a irradiation energy of the pulse laser beam, a process point depth of the pulse laser beam and lengths of a irradiation area and a non-irradiation area of the pulse laser beam, the laser dicing method comprising:
- a first crack forming of irradiating the pulse laser beam on the work piece along a first line;
- and a second crack forming of irradiating the pulse laser beam on the work piece along a second line orthogonal to the first line,
- wherein, in an area in which the first line and the second line cross, irradiation of the pulse laser beam is interrupted in one of the first crack forming step and the second crack forming step.
Dependencies are inferred from the claim text.