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US 2014/0004637 A1Published application
Method of manufacturing an led
AssigneeNitto Denko Corporation
InventorsTomokazu Takahashi, Shinya Akizuki, Toshimasa Sugimura, Takeshi Matsumura, Daisuke Uenda
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Abstract
A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate; forming, after the back-grinding, a reflective layer on an outer side of the substrate; and attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.
Claims3
A method of manufacturing an LED, the method comprising:
- back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate;
- forming, after the back-grinding, a reflective layer on an outer side of the substrate;
- and
- attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.
1 more element
Dependencies are inferred from the claim text.