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US 2014/0004636 A1Published application
Method of manufacturing an led
AssigneeNitto Denko Corporation
InventorsTomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
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Abstract
A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.
Claims5
A method of manufacturing an LED, the method comprising:
- back-grinding a substrate of an LED wafer including a light emitting element and the substrate;
- and
- attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.
Dependencies are inferred from the claim text.