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US 2014/0004635 A1Published application
Method of manufacturing an led
AssigneeNitto Denko Corporation
InventorsTomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
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Abstract
A method of manufacturing an LED according to an embodiment of the present invention includes: forming a reflective layer on an outer side of a substrate of an LED wafer including the substrate and a light emitting element on one surface of the substrate; and attaching, prior to the forming a reflective layer, a heat-resistant pressure-sensitive adhesive sheet onto an outer side of the light emitting element.
Claims2
A method of manufacturing an LED, the method comprising:
- forming a reflective layer on an outer side of a substrate of an LED wafer including the substrate and a light emitting element on one surface of the substrate;
- and
- attaching, prior to the forming a reflective layer, a heat-resistant pressure-sensitive adhesive sheet onto an outer side of the light emitting element.
Dependencies are inferred from the claim text.