Method for manufcturing light emitting diode package
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsCHUNG-MIN CHANG, CHIEN-LIN CHANG-CHIEN, HSUEN-FENG HU, CHANG-WEN SUN
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Abstract
A method for manufacturing a method for manufacturing a light emitting diode (LED) package includes following steps: providing a substrate and a blocking member formed on a top surface of the substrate; providing an LED chip and mounting the LED chip on the top surface of the substrate, the LED chip enclosed by the blocking member; providing a dispensing machine with glue, dispensing the glue in the blocking member to make the glue encapsulate the LED chip; and heating the glue to obtain a lens formed on the substrate directly.
Claims9
A method for manufacturing a light emitting diode (LED) package comprising following steps:
- providing a substrate and a blocking member formed on a top surface of the substrate;
- providing an LED chip and mounting the LED chip on the top surface of the substrate, the LED chip enclosed by the blocking member;
- providing a dispensing machine with glue, dispensing the glue in the blocking member to make the glue encapsulate the LED chip;
- and
- heating the glue to obtain a lens formed on the substrate directly.
Dependencies are inferred from the claim text.