US 2014/0004630 A1Published application

Heterostructure containing ic and led and method for fabricating the same

AssigneeNational Chiao Tung University

InventorsKUAN-NENG CHEN, CHENG-TA KO, WEI-CHUNG LO

Life of this patent

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Abstract

A heterostructure containing IC and LED and a method of fabricating. An IC and an LED are established with the IC having a first electric-conduction block and a first connection block. The IC electrically connects to the first electric-conduction block. A first face of the LED has a second electric-conduction block and a second connection block. The LED is electrically connected to the second electric-conduction block. The first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block, and the first electric-conduction block are electrically connected with the second electric-conduction block to form a heterostructure. The heterostructure provides functions of heat radiation and electric communication for IC and LED.

Claims11

Dependent claims

A method for fabricating a heterostructure containing an integrated circuit (IC) and a light emitting diode (LED), comprising steps:

providing an IC and an LED, wherein at least one first electric-connection block and at least one first connection block are arranged on one surface of said IC, and wherein said first electric-connection block is electrically connected with said IC, and wherein said LED has a first face and a second face opposite to said first face, and wherein said first face has at least one second electric-conduction block and at least one second connection block, and wherein said second electric-conduction block is electrically connected with said LED;
and
respectively joining said first electric-conduction block and said first connection block to said second electric-conduction block and said second connection block so as to bond said IC to said LED and realize electric connection of said first electric-conduction block and said second electric-conduction block.

Dependencies are inferred from the claim text.

Facts

Application: 14/019,933Filed 6 Sep 2013
Priority: TW 1001197557 Jun 2011
Published: 2 Jan 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification31 codes

H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
H10W 90/00
Package configurations
H10W 72/01235
In liquid form, e.g. spin coating, spray coating or immersion coating: by plating, e.g. electroless plating or electroplating
H10W 72/01253
Changing the shapes of bumps: by etching

Family

Application13/224,607Division · filed 2 Sep 2011
Application14/019,933Division
US 2012/0313133 A1Published application
US 8,536,613 B2Related patent
US 8,679,891 B2Related patent
US 2014/0004630 A1This patent

From the US filing history. Foreign family members aren’t listed.