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US 2014/0004374 A1Published application
Multi-Layer Encapsulated Structures
AssigneeUniversity of Southern California
InventorAdam L. Cohen
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Abstract
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Claims11
A multi-layer structure, comprising:
- i. at least one first layer comprising at least one first planarized material;
- ii. at least one second layer comprising at least one core material and at least one second material, whereby the at least one second material completely surrounds the sides of the at least one core material and wherein the at least one core material is completely bounded from below by the first layer;
- and
- iii. at least one third layer comprising at least one third planarized material wherein the third layer completely bounds the at least one core material of the at least one second layer from above;
- wherein the at least one core material is completely encapsulated by a combination of the at least one first planarized material, the at least one second material, and the at least one third material.
2 more elements
Dependencies are inferred from the claim text.