Substrate cores for laser through hole formation
OwnerNikhil Sharma, Chong Zhang +2inventors
InventorsNikhil Sharma, Chong Zhang, Tao Wu, Islam A. Salama
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OwnerNikhil Sharma, Chong Zhang +2inventors
InventorsNikhil Sharma, Chong Zhang, Tao Wu, Islam A. Salama
Estimating the term…
Substrate cores for laser through hole formation are described. Substrate core embodiments include a plurality of reinforcement material layers and a microfiller loaded resin disposed between the plurality of reinforcement material layers. Microfiller and reinforcement materials are selected to reduce opto-thermal mismatch for a laser of a predetermined bandwidth. In embodiments, the reinforcement material may include a fibrous polymer, reducing the thermal contrast with the microfiller loaded resin, and/or include a chromophore that absorbs within the laser bandwidth. In further embodiments, the microfiller is of a material having a high melting temperature to reduce thermal contrast with the reinforcement material.
A package substrate core, comprising:
The package substrate core of claim 9, wherein the reinforcement material comprises a colorant containing the chromophore, and wherein the colorant is selected from the group consisting of:
A package substrate core, comprising:
A package substrate comprising:
Dependencies are inferred from the claim text.