Low dielectric resin composition, applicable copper-clad laminate and printed circuit board
AssigneeElite Electronic Material (Zhongshan) Co., Ltd.
InventorsCHEN-YU HSIEH, CHANG-YUAN LI
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Abstract
A resin composition includes (A) 100 parts by weight of poly(phenylene oxide) resin with styrene end group; (B) 5 to 75 parts by weight of olefin copolymer; and (C) 1 to 150 parts by weight of cyanate resin with poly(phenylene oxide) functional group. The resin composition is characterized by specific composition and proportion conducive to achieving a low dielectric constant, a low dielectric loss, and a high thermal tolerance and preparing a prepreg or a resin film, thereby being applicable to copper-clad laminates and printed circuit boards.
Claims12
A resin composition for copper clad laminate, comprising:
- (A) 100 parts by weight of poly (phenylene oxide) resin with styrene end group;
- (B) 5 to 75 parts by weight of olefin copolymer;
- and
- (C) 1 to 150 parts by weight of cyanate resin with poly (phenylene oxide) functional group.
Dependencies are inferred from the claim text.