Device and method for stripping a product substrate from a carrier substrate
AssigneeEV Group GmbH
InventorsFriedrich Paul Lindner, Jurgen Burggraf
Life of this patent
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Abstract
Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
Claims9
A method for at least partially detaching a product substrate from a carrier substrate wherein the product substrate and the carrier substrate are bonded together by a connecting layer, said method comprising steps of:
- exposing the connecting layer to fluid materials that include a connection detachment material for dissolving the connecting layer, and
- exposing the connecting layer to sound waves produced by a sound generating material for accelerating the rate that the product substrate is detached from the carrier substrate.
A device for at least partially detaching a product substrate from a carrier substrate wherein the product substrate and the carrier substrate are bonded together by a connecting layer, the device comprising:
- a fluid material that includes a connection detachment material that selectively dissolves the connecting layer, and
- a sound wave generating material for accelerating the rate of detachment using sound waves.
Dependencies are inferred from the claim text.