Bonding apparatus
AssigneeShibuya Kogyo Co., Ltd.
InventorsTadashi YOSHIDA, Eiji TANAKA
Life of this patent
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Abstract
A bonding apparatus includes: a bonding head including a bonding tool, on which a suction surface for a chip is formed, and a heating unit; a chip supply unit; a bonding stage on which a substrate is arranged; a head movement unit configured to move the bonding head between a chip supply position by the chip supply unit and a bonding position on the bonding stage; and a cooling unit configured to cool the bonding tool. The bonding tool is configured such that the chip is supplied at the chip supply position, then is heated and bonded on the substrate at the bonding position, and is then cooled by the cooling unit. The cooling is performed by making the suction surface come in contact with a cooling surface of the cooling unit.
Claims4
A bonding apparatus comprising:
- a bonding head comprising a bonding tool, on which a suction surface for sucking and maintaining a chip is formed, and a heating unit;
- a chip supply unit configured to supply the chip to the bonding tool;
- a bonding stage on which a substrate is arranged;
- a head movement unit configured to move the bonding head between a chip supply position by the chip supply unit and a bonding position on the bonding stage;
- and
- a cooling unit configured to cool the bonding tool,
- wherein the bonding apparatus is configured to:
- supply the chip from the chip supply position to the bonding tool;
- perform bonding of the chip on the substrate through heating the chip in the bonding position;
- and then
- cool the bonding tool by the cooling unit,
- wherein the cooling unit has a cooling surface configured to come in contact with the suction surface of the bonding tool, and
- wherein the cooling unit is configured to cool the bonding tool through making the cooling surface come in contact with the suction surface.
Dependencies are inferred from the claim text.