Manufacturing method for monolithic ceramic electronic component

A manufacturing method for a monolithic ceramic-electronic component, comprising the steps of:

• preparing a mother block including a plurality of ceramic green sheets that are stacked on each other, and an internal electrode pattern arranged along each of a plurality of interfaces between the ceramic green sheets;
• performing a first cutting including cutting the mother block along a first cutting line to obtain a plurality of rod-shaped green block bodies, the rod-shaped green block bodies each having a laminated structure including a plurality of ceramic layers and a plurality of internal electrodes that are in a raw state, the internal electrodes being exposed on a cut side surface that is produced by the first cutting along the first cutting line;
• affixing a side surface ceramic green sheet to the cut side surface to form a raw ceramic protective layer;
• performing a second cutting including cutting each of the rod-shaped green block bodies along a second cutting line extending in a direction perpendicular or substantially perpendicular to the first cutting line to obtain a plurality of raw component bodies that are each a component body in a raw state;
• firing the plurality of raw component bodies;
• and
• applying an adhesive between the side surface ceramic green sheet and the cut side surface, the step of applying the adhesive being performed on the plurality of raw component bodies or on the side surface ceramic green sheet.

A manufacturing method for a monolithic ceramic electronic component, comprising the steps of:

• preparing a mother block including a plurality of ceramic green sheets that are stacked on each other, and an internal electrode pattern arranged along each of a plurality of interfaces between the ceramic green sheets;
• performing a first cutting including cutting the mother block along a first cutting line to obtain a plurality of rod-shaped green block bodies, the rod-shaped green block bodies each having a laminated structure including a plurality of ceramic layers and a plurality of internal electrodes that are in a raw state, the internal electrodes being exposed on a cut side surface that is produced by the first cutting along the first cutting line;
• affixing a side surface ceramic green sheet to the cut side surface to form a raw ceramic protective layer in a state in which the side surface ceramic green sheet which is not backed with a carrier film is placed on an affixation elastic body;
• performing a second cutting including cutting each of the rod-shaped green block bodies along a second cutting line extending in a direction perpendicular or substantially perpendicular to the first cutting line to obtain a plurality of raw component bodies that are each a component body in a raw state;
• and
• firing each of the plurality of raw component bodies.