Heat-sealing material, laminated body, and solar-cell module using the same
AssigneeDIC Corporation
InventorsChisato Kuriyama, Kazuhiko Chiyonobu, Mitsuru Kitada
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AssigneeDIC Corporation
InventorsChisato Kuriyama, Kazuhiko Chiyonobu, Mitsuru Kitada
Estimating the term…
The present invention provides an aqueous resin composition that can form a cured resin layer that exhibits high adhesion to a base member and high moisture-heat resistance. The present invention relates to a heat-sealing material including an aqueous urethane resin (A), an aqueous polyolefin resin (B), a cross-linking agent (C), and an aqueous medium (D), wherein the cross-linking agent (C) contains an alkylated methylolmelamine resin (c1) and an epoxy compound (c2), the content of the alkylated methylolmelamine resin (c1) is in the range of 5% to 50% by mass, one or both of the aqueous urethane resin (A) and the aqueous polyolefin resin (B) have a functional group [X] that is capable of reacting with an epoxy group, and the molar ratio of the amount of substance having an epoxy group to the total amount of substance having the functional group [X] is 5/1 to 1/5.
A heat-sealing material comprising:
Dependencies are inferred from the claim text.