Substrate processing apparatus and substrate processing method

A substrate processing method comprising:

• providing a processing chamber configured to process a substrate on which a target substrate to be removed is formed on the surface of an underlying layer, the substrate being held by a substrate holding unit;
• supplying a mixed liquid of sulfuric acid and hydrogen peroxide to the substrate from a mixed liquid supplying unit in a mixing ratio of the hydrogen peroxide and a temperature that does not damage the underlying layer while removing the target layer, thereby removing the target layer;
• and
• supplying a fluid containing OH-group to the substrate from an OH-group supplying unit in an amount that does not damage the underlying layer when the mixed liquid and the OH-group are mixed on the substrate.

A non-transitory computer-readable storage medium for storing a computer program that, when executed, cause a computer to perform a substrate processing method, the substrate processing method comprising:

• providing a processing chamber configured to process a substrate on which a target substrate to be removed is formed on the surface of an underlying layer, the substrate being held by a substrate holding unit;
• supplying a mixed liquid of sulfuric acid and hydrogen peroxide to the substrate from a mixed liquid supplying unit in a mixing ratio of the hydrogen peroxide and a temperature that does not damage the underlying layer while removing the target layer, thereby removing the target layer;
• and
• supplying a fluid containing OH-group to the substrate from an OH-group supplying unit in an amount that does not damage the underlying layer when the mixed liquid and the OH-group are mixed on the substrate.