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US 2013/0340648 A1Published application
Electroless Deposition of Platinum on Copper
AssigneeIntermolecular, Inc.
InventorsBob Kong, Igor Ivanov, Zhi-Wen Sun, Jinhong Tong
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Abstract
Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices.
Claims20
An electroless plating solution, comprising:
- a platinum supply chemical mother solution having a pH between about 13 and about 14;
- a reducing agent comprising hydrazine;
- and
- deionized water;
- wherein the platinum supply chemical mother solution comprises chloroplatinic acid (H2PtCl6) and hydrogen hexahydroxyplatinate (H2Pt(OH)62−);
- wherein a platinum concentration in the electroless plating solution is between about 2 mM and about 50 mM;
- and
- wherein a hydrazine concentration in the electroless plating solution is between about 0.1M and about 1M. [0015] [0016] [0017]
5 more elements
Dependencies are inferred from the claim text.