Mems inertial sensor and forming method therefor
AssigneeMemsen Electronics Inc
InventorLianjun Liu
Life of this patent
Estimating the term…
Abstract
A MEMS inertial sensor, may include a movable sensitive element; and second substrate and a third substrate. The movable sensitive element may be formed by using a first substrate which may be formed of a monocrystalline semiconductor material. The first substrate may include a first surface and a second surface which are opposite to each other. One or more conductive layers may be formed on the first surface of the first substrate The second substrate may be coupled to a surface of the one or more conductive layer on the first substrate. The third substrate may be coupled to the second surface of the first substrate. The third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element.
Claims21
A MEMS inertial sensor, comprising:
- a movable sensitive element;
- and
- a second substrate and a third substrate;
- wherein the movable sensitive element is formed by using a first substrate which is formed of a monocrystalline semiconductor material, the first substrate comprises a first surface and a second surface which are opposite to each other, one or more conductive layers are formed on the first surface of the first substrate, the second substrate is coupled to a surface of the one or more conductive layer on the first substrate, the third substrate is coupled to the second surface of the first substrate, and the third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element.
A method for forming a MEMS inertial sensor, comprising:
- providing a first substrate, wherein the first substrate is a monocrystalline semiconductor substrate, and the first substrate has a first surface and a second surface opposite to the first surface;
- forming one or more conductive layers on the first surface of the first substrate;
- providing a second substrate;
- coupling the second substrate to a surface of the one or more conductive layer on the first substrate;
- forming a movable sensitive element by using the first substrate from the side of the second surface of the first substrate;
- providing a third substrate;
- and
- coupling the third substrate to the second surface of the first substrate, wherein the third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element.
(canceled)
Dependencies are inferred from the claim text.