US 2013/0340525 A1 · INTEGRATED INERTIAL SENSOR AND PRESSURE SENSOR, AND FORMING METHOD THEREFOR

Abstract

An integrated inertial sensor and pressure sensor may include a first substrate including a first surface and a second surface; at least one or more conductive layers, formed on the first surface of the first substrate; a movable sensitive element, formed by using a first region of the first substrate; a second substrate and a third substrate, the second substrate being coupled to a surface of the conductive layer, the third substrate being coupled to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, and the third substrate and the second substrate are respectively arranged on opposite sides of the movable sensitive element; and a sensitive film of the pressure sensor, including at least a second region of the first substrate, or including at least one of the conductive layers on the second region of the first substrate.

Claims22

Dependent claims

An integrated inertial sensor and pressure sensor, comprising:

a first substrate comprising a first surface and a second surface opposite to the first surface, and the first substrate comprising a first region and a second region;
at least one or more conductive layers, formed on the first surface of the first substrate;
a movable sensitive element of the inertial sensor, formed by using the first region of the first substrate;
a second substrate and a third substrate, the second substrate being coupled to a surface of the conductive layer on the first surface of the first substrate, the third substrate being coupled to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, and the third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element of the inertial sensor;
and
a sensitive film of the pressure sensor, comprising at least the second region of the first substrate, or comprising at least one of the conductive layers on the second region of the first substrate.

3 more elements

A method for forming an integrated inertial sensor and pressure sensor, comprising:

providing a first substrate, wherein the first substrate comprises a first surface and a second surface opposite to the first surface, and the first substrate comprises a first region and a second region;
forming one or more conductive layers on the first surface of the first substrate;
providing a second substrate and a third substrate;
coupling the second substrate to a surface of the conductive layer on the first surface of the first substrate;
forming a movable sensitive element of the inertial sensor by using the first region of the first substrate;
forming a sensitive film of the pressure sensor, wherein the sensitive film comprises at least the second region of the first substrate, or comprises at least one of the conductive layers on the second region of the first substrate;
and
coupling the third substrate to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, wherein the third substrate and the second substrate are respectively arranged on two opposite sides of the movable sensitive element of the inertial sensor.

5 more elements

Dependencies are inferred from the claim text.

Integrated inertial sensor and pressure sensor, and forming method therefor

Life of this patent

Integrated inertial sensor and pressure sensor, and forming method therefor

Life of this patent

Abstract

Claims22