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US 2013/0340249 A1Published application
Method of manufacturing multilayer circuit substrate
AssigneeFujitsu Limited
InventorTakashi KANDA
Life of this patent
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Abstract
A method of manufacturing a multilayer circuit substrate, the method includes: injecting a conductive paste into through-holes provided in an insulating substrate to one or both sides of which a protection film is attached; cooling and setting the conductive paste injected into the through-holes; and removing the protection film from the insulating substrate after cooling and setting the conductive paste.
Claims3
A method of manufacturing a multilayer circuit substrate, the method comprising:
- injecting a conductive paste into through-holes provided in an insulating substrate to one or both sides of which a protection film is attached;
- cooling and setting the conductive paste injected into the through-holes;
- and
- removing the protection film from the insulating substrate after cooling and setting the conductive paste.
1 more element
Dependencies are inferred from the claim text.