Positive resist composition for immersion exposure and pattern forming method
AssigneeFUJIFILM Corporation
InventorsKei YAMAMOTO, Hiroshi SAEGUSA
Life of this patent
Estimating the term…
Abstract
A positive resist composition for immersion exposure includes the following (A) to (D): (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a resin having at least either one of a fluorine atom and a silicon atom; and (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3) as defined in the specification, in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D).
Claims20
A positive resist composition for immersion exposure, comprising the following (A) to (D):
- (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer;
- (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation;
- (C) a resin having at least either one of a fluorine atom and a silicon atom;
- and
- (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3), in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D):
- wherein each of R1 to R7 independently represents an alkyl group, a cycloalkyl group or an aryl group;
- and
- R1 and R2, R3 and R4, and R6 and R7 may combine with each other to form a ring, respectively,
- the resin (C) contains at least one group selected from the group consisting of the following (x) to (z):
- (x) an alkali-soluble group,
- (y) a group capable of decomposing by the action of an alkali developer to increase the solubility in an alkali developer, and
- (z) a group capable of decomposing by the action of an acid,
- polydispersity of the resin (C) is from 1 to 2, and
- the compound (B) is a compound represented by the following formula (ZI):
- wherein R202 and R203 independently represents an organic group,
- Z− is an aliphatic sulfonate anion substituted by a fluorine atom at the α-position of the sulfonic acid.
A positive resist composition for immersion exposure, comprising the following (A) to (D):
- (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer;
- (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation;
- (C) a resin having at least either one of a fluorine atom and a silicon atom;
- and
- (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3), in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D):
- wherein each of R1 to R7 independently represents an alkyl group, a cycloalkyl group or an aryl group;
- and
- R1 and R2, R3 and R4, and R6 and R7 may combine with each other to form a ring, respectively,
- the resin (C) contains at least one group selected from the group consisting of the following (x) to (z):
- (x) an alkali-soluble group,
- (y) a group capable of decomposing by the action of an alkali developer to increase the solubility in an alkali developer, and
- (z) a group capable of decomposing by the action of an acid,
- the mixed solvent (D) further contains at least one selected from the group consisting of ethyl lactate, cyclohexanone and 2-heptanone.
A positive resist composition for immersion exposure, comprising the following (A) to (D):
- (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer;
- (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation;
- (C) a resin having at least either one of a fluorine atom and a silicon atom;
- and
- (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3), in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D):
- wherein each of R1 to R7 independently represents an alkyl group, a cycloalkyl group or an aryl group;
- and
- R1 and R2, R3 and R4, and R6 and R7 may combine with each other to form a ring, respectively,
- the resin (C) contains at least one group selected from the group consisting of the following (x) to (z):
- (x) an alkali-soluble group,
- (y) a group capable of decomposing by the action of an alkali developer to increase the solubility in an alkali developer, and
- (z) a group capable of decomposing by the action of an acid,
- the compound (B) is a compound represented by the following formula (I):
- wherein X+ represents an organic counter ion, and
- R represents a hydrogen atom or an organic group.
Dependencies are inferred from the claim text.