Back to results
US 2013/0334292 A1Published application
Printed Circuit Boards
AssigneeSemblant Global Limited
InventorsFrank Ferdinandi, Rodney Edward Smith, Mark Robson Humphries
Life of this patent
Estimating the term…
Abstract
A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
Claims37
1-12. (canceled)
A method, comprising:
- attaching a plurality of conductive tracks to at least one surface of a substrate comprising an insulating material;
- depositing a coating on the at least one surface of the substrate, the coating covering at least a portion of the plurality of conductive tracks, the coating comprising at least one halo-hydrocarbon polymer;
- and
- after depositing the coating, soldering through the coating to form a solder joint between an electrical component and at least one conductive track attached to the substrate, the solder joint abutting the coating.
1 more element
A method, comprising:
- forming a substrate comprising an insulating material;
- forming a plurality of conductive tracks on at least one surface of the substrate to form a printed circuit board;
- and
- prior to soldering one or more components to the plurality of conductive tracks, depositing a coating on the at least one surface of the substrate, wherein the coating:
- protects the plurality of conductive tracks from oxidation;
- and
- comprises at least one halo-hydrocarbon polymer that allows a connection to be soldered through the coating to at least one conductive track without first removing the coating from the at least one conductive track.
4 more elements
Dependencies are inferred from the claim text.